TNI Bureau: Odisha is set to host the groundbreaking ceremony of India’s first Advanced Glass Semiconductor Packaging Unit backed by backed by Intel and Lockheed Martin, on April 19, 2026, in Bhubaneswar. The project, titled Heterogeneous Integration Packaging Solutions (3D Glass Solutions), marks a significant step in positioning India as a global hub for advanced semiconductor manufacturing.
The ceremony will be graced by Chief Minister Mohan Charan Majhi, in the presence of Union Minister Ashwini Vaishnaw and Odisha’s Electronics & IT Minister Mukesh Mahaling. Senior government officials, global industry leaders, investors, and academia are also expected to attend.
The project introduces cutting-edge 3D heterogeneous integration technology and will be the first in India to use glass substrates for advanced semiconductor packaging. Approved by the Union Cabinet and fast-tracked for execution, the unit represents an investment of approximately ₹1,943 crore.
Once operational, the facility is expected to generate around 2,500 direct and indirect jobs and will have an annual production capacity of 50 million assembled units. The chips produced will support critical sectors such as aerospace, defence, artificial intelligence, 5G, and data centres.
With this development, Odisha becomes the first state in India to host both a compound semiconductor fabrication unit and an advanced 3D chip packaging facility based on glass substrates, strengthening its position in the country’s semiconductor ecosystem.
The initiative reflects the state government’s focus on promoting high-tech industries, attracting global investments, and building an innovation-driven economy aligned with the vision of Atmanirbhar Bharat.
