TNI Bureau: Odisha has taken a major step towards becoming a hub for semiconductor manufacturing with the signing of a landmark Memorandum of Understanding (MoU) between the Odisha Government, Intel Corporation and US-based 3DGS Inc. to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in the state.
The MoU was signed in the presence of Union Electronics and Information Technology Minister Ashwini Vaishnaw, Odisha Chief Minister Mohan Charan Majhi, Intel CEO Lip-Bu Tan and other dignitaries. The proposed facility is planned for the Bhubaneswar-Khurda region and is expected to be one of the largest high-technology manufacturing investments in India.
The project will be implemented in phases over the next five to six years. It is expected to create a large number of high-skilled direct jobs while also generating significant indirect employment opportunities across the manufacturing and technology sectors.
The facility will focus on the production of advanced packaging glass core substrates, high-density interconnect substrates and related semiconductor technologies. Intel will provide technology expertise and process know-how to support the project.
Speaking on the occasion, Union Minister Ashwini Vaishnaw said the agreement aligns with the Government of India’s vision of developing a complete semiconductor manufacturing ecosystem in the country. He noted that the growing presence of global technology companies and recent partnerships in the semiconductor sector reflect the industry’s confidence in India’s capabilities.
The project is expected to strengthen India’s semiconductor supply chain, boost domestic manufacturing and support export-oriented production. It will also contribute to the objectives of the India Semiconductor Mission by enhancing technological capabilities and fostering ecosystem growth.
With this initiative, Odisha is set to emerge as a key destination for semiconductor manufacturing and advanced digital infrastructure, further strengthening India’s position in the global semiconductor industry.
 between the Odisha Government, Intel Corporation and US-based 3DGS Inc. to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in the state.){kind=link}